Nottay, J; Tomlins, P E; Subotic, B (2000) Thermal cycling and the adhesion of glob tops. NPL Report. CMMT(A)287

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Abstract

In this study we investigate different methods of assessing the influence that thermal cycling has on the adhesion of curable plastic encapsulants to substrates using a range of both destructive and non-destructive test techniques. The results show that non-destructive measurements such as surface insulation resistance (SIR) or capacitance are unable to differentiate between bound and delaminated encapsulants. The results of the destructive (mechanical) test methods appear to be independent of the geometry of the encapsulant and the area that it covers. The results show that there is an excellent adhesive bond between most of the encapsulants studied and both FR-4 and ceramic substrates that is not adversely affected by a prolonged period of thermal cycling in a dry environment.

Item Type:	Report/Guide (NPL Report)
NPL Report No.:	CMMT(A)287
Subjects:	Advanced Materials Advanced Materials > Adhesives
Last Modified:	02 Feb 2018 13:17
URI:	http://eprintspublications.npl.co.uk/id/eprint/1879

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