Hunt, C P; Willis, B* (2015) Practical guide to soldering PCBs with high temperature solder alloys. Measurement Good Practice Guide. 136

Hunt, C P; Wickham, M; Pittson, R*; Lewison, J* (2015) Reusable, unzippable, sustainable electronics (ReUse) interconnect system for the circular economy. NPL Report. MAT 75

Hunt, C P; Crocker, L E; Thomas, O; Wickham, M; Clayton, K; Zou, L; Ashayer-Soltani, R; Longford, A* (2014) High temperatures solder replacement to meet RoHS. NPL Report. MAT 64

Thomas, O J; Hunt, C P; Wickham, M (2012) Finite difference modelling of moisture diffusion in printed circuit boards with ground planes. Microelectron. Reliability, 52 (1). pp. 253-261.

Di Maio, D; Thomas, O; Dusek, M; Hunt, C P (2011) Novel testing instrument for lead-free solder characterisation. IEEE Trans. Instrum. Meas., 60 (10). pp. 3444-3450.

Hunt, C P; Wickham, M; Thomas, O; Zou, L (2010) Impedance testing for sensitivity to delamination in printed circuit boards. NPL Report. MAT 40

Hunt, C P; Wickham, M; Thomas, O; Zou, L (2010) Assessment of moisture content measurement methods for printed circuit boards. In: Annual IPC International Conference for Electronics Board Design and Manufacture and Assembly., 6-8 April 2010, Las Vegas, USA.

Hunt, C P; Di Maio, D (2009) Allotropic transformation in tin and lead free solder alloys: Measuring the effect and implications for industry. NPL Report. MAT 35

Hunt, C P; Wickham, M (2009) Evaluation of the ability of conformal coatings to inhibit tin whiskering. NPL Report. MAT 36

Hunt, C P (2009) Implementation and reliability issues with lead-free solders. In: Surface Mount Technology Association International Conference (SMTA 2009), 4-8 October 2009, San Diego, CA, USA.

Wickham, M; Zou, L; Hunt, C P (2009) Measuring the effect of substrate and component finishes on the reliability of isotropic electrically conductive adhesive joints. Solder. Surf. Mount Technol., 21 (4). pp. 12-18.

Di Maio, D; Hunt, C P (2009) On the factors affecting the dissolution of copper in molten lead-free solders and development of a method to assess the soldering parameters. Solder. Surf. Mount Technol., 21 (4). pp. 24-31.

Di Maio, D; Hunt, C P; Willis, B (2008) Reduce copper dissolution in lead-free assembly. Measurement Good Practice Guide. 110

Di Maio, D; Hunt, C P (2008) High-frequency vibration tests of Sn-Pb and lead-free solder joints. In: ESTC 2008: 2nd Electronics System-integration Technology Conference Proceedings, 2008.

Dusek, M; Hunt, C P (2007) Low cycle isothermal fatigue properties of lead-free solders. NPL Report. DEPC-MPR 058

Wickham, M; Zou, L; Hunt, C P (2006) Measuring the reliability of technology demonstrator manufactured with isotropic electrically conductive adhesives. NPL Report. DEPC-MPR 046

Wickham, M; Zou, L; Hunt, C P (2006) Measuring the effect on isotropic electrically conductive adhesive reliability of joint design characteristics. NPL Report. DEPC-MPR 045

Wickham, M; Zou, L; Dusek, M; Hunt, C P (2006) Measuring the impact of land size and solder joint volume on lead-free solder joint reliability. NPL Report. DEPC-MPR 044

Dusek, M; Hunt, C P (2006) Statistical analysis of the effect of PCB finish and processing solder joint on integrity. NPL Report. DEPC-MPR 047

Dusek, M; Hunt, C P (2006) Test approach to isothermal fatigue measurements for lead-free solders. NPL Report. DEPC-MPR 048

Wickham, M; Zou, L; Dusek, M; Hunt, C P (2003) Influence of stencil and aperture design on fine pitch printing for various solder paste types. NPL Report. MATC(A)145

Wickham, M J; Hunt, C P (2001) Thermal profiling of electronic assemblies. NPL Report. MATC(A)50

Hunt, C P (2000) Tack testing: critique and recommendations for a new test. NPL Report. CMMT(A)253

Wickham, M; Dusek, M; Zou, L; Hunt, C P (1999) Improving the processability of noble metal component termination finishes. NPL Report. CMMT(A)199

Hunt, C P; Wickham, M (1999) Stencil printing codes of practice. NPL Report. CMMT(A)165

Zou, L; Dusek, M; Hunt, C P; Dunn, B D* (1999) An evaluation of the effect of ageing on the cleanability of solder flux residues. Soldering & Surface Mount Technology, 11 (1). pp. 27-35.

Seah, M P; Hunt, C P (1994) Optimisation and specification of Auger electron spectrometers for signal-to-noise ratio performance. J. Electron Spectrosc. Relat. Phenom., 67. pp. 151-157.

Seah, M P; Hunt, C P (1993) Optimisation and specification of auger electron spectrometers for signal-to-noise ratio performace. NPL Report. DMM(A)101

Seah, M P; Hunt, C P; Tosa, M (1993) Development of a reference material and reference method to provide a calibration of the instrument intensity scale for differential AES. J. Electron Spectrosc. Relat. Phenom., 61 (2). pp. 149-171.

Seah, M P; Hunt, C P; Sykes, D*; Valeri, S*; Muller, R*; Lamb, B* (1993) Interlaboratory tests of a composite reference sample to calibrate Auger electron spectrometers in the differential mode. J. Electron Spectrosc. Relat. Phenom., 61 (2). pp. 173-182.

Hunt, C P; Seah, M P (1992) Submonolayer adsorbate reference material based on a low alloy steel fracture sample for Auger electron spectroscopy. 1 Characteristics. Mater. Sci. Technol., 8 (11). pp. 1023-1035.

Seah, M P; Hunt, C P; Younes, C M*; Allen, G C*; Viefhaus, H*; Lee, B J*; Wild, R K*; Bishop, H E; English, T* (1992) Submonolayer adsorbate reference material based on a low alloy steel fracture sample for Auger electron spectroscopy. 2 Interlaboratory tests. Mater. Sci. Technol., 8 (11). pp. 1036-1041.