Hunt, C P (2009) Implementation and reliability issues with lead-free solders. In: Surface Mount Technology Association International Conference (SMTA 2009), 4-8 October 2009, San Diego, CA, USA.

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Abstract

Manufacturing high reliability lead-free circuit assemblies is challenging, and understanding the pitfalls and knowing material properties is clearly desirable. This paper will address a wide range of issues, which include material and processing properties. Examples of these phenomena include: copper dissolution, tin whisker mitigation, PTH reliability, measuring solder joint reliability, conformal coating protection, and tin pest.

Item Type:	Conference or Workshop Item (UNSPECIFIED)
Subjects:	Advanced Materials Advanced Materials > Electronics Interconnection
Last Modified:	02 Feb 2018 13:15
URI:	http://eprintspublications.npl.co.uk/id/eprint/4569

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