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Thermal profiling of electronic assemblies.

Wickham, M J; Hunt, C P (2001) Thermal profiling of electronic assemblies. NPL Report. MATC(A)50

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With the advent of lead-free soldering there is a greater need for thermal profiling of electronic assemblies during soldering, so that the more stringent requirements, of achieving reflow while not exceeding the specified maximum temperature of components, can be met. The requirement for greater precision has required that all aspects of profiling have been investigated and the impact on the measurement certainty assessed.
From these experiments a number of important recommendations are made and constitute an industry Code of Practice. Issues covered include: thermocouple logger position; initial profiling and setting up.

Item Type: Report/Guide (NPL Report)
NPL Report No.: MATC(A)50
Subjects: Advanced Materials
Advanced Materials > Electronics Interconnection
Last Modified: 02 Feb 2018 13:17
URI: http://eprintspublications.npl.co.uk/id/eprint/2111

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