Report/Guide

Hunt, C P; Crocker, L E; Thomas, O; Wickham, M; Clayton, K; Zou, L; Ashayer-Soltani, R; Longford, A* (2014) High temperatures solder replacement to meet RoHS. NPL Report. MAT 64

Hunt, C P; Wickham, M; Thomas, O; Zou, L (2010) Impedance testing for sensitivity to delamination in printed circuit boards. NPL Report. MAT 40

Article

Lewis, A P; Hunt, C; Thomas, O; Wickham, M (2017) High-Speed Non-Contact Sheet Resistivity Monitoring of Printed Electronics using Inductive Sensors. Flexible and Printed Electronics, 2 (4). 044001

Gopee, V; Thomas, O; Hunt, C; Stolojan, V*; Allam, J*; Silva, S R P* (2016) Carbon nanotube interconnects realized through functionalization and sintered silver attachment. ACS Appl. Mater. Interfaces, 8 (8). pp. 5563-5570.

Ashayer-Soltani, R; Hunt, C; Thomas, O (2016) Fabrication of highly conductive stretchable textile with silver nanoparticles. Tex. Res. J., 86 (10). pp. 1041-1049.

Samano, A*; Xu, Y*; Harrison, D*; Hunt, C; Wickham, M; Thomas, O (2016) Impedance and resistance of carbon ink during cure. Circuit World, 42 (3). pp. 117-126.

Fiorillo, F*; Beatrice, C*; Son, D*; Ahlers, H*; Groessinger, R*; Albertini, F*; Liu, Y P*; Lin, A*; Patroi, E*; Shull, R*; Thomas, O; Hall, M J (2014) International comparison of measurements of hard magnetics with the vibrating sample magnetometer. Int. J. Appl. Electrom. Mechan., 44 (3-4). pp. 245-252.

Hall, M; Harmon, S; Thomas, O (2013) So, you need reliable magnetic measurements you can use with confidence? How the magnetic measurement capabilities at NPL can help. J. Magn., 18 (3). pp. 339-341.

Thomas, O; Wickham, M; Hunt, C (2012) Obtaining the moisture content of printed circuit boards from capacitance measurements. Circuit World, 38 (2). pp. 68-74.

Hall, M J; Thomas, O; Smith, H*; Anderson, P* (2011) Equivalence of measurements on soft magnetic materials in the UK and measurements for operational conditions. IEEE Trans. Instrum. Meas., 60 (7). pp. 2275-2279.

Di Maio, D; Thomas, O; Dusek, M; Hunt, C P (2011) Novel testing instrument for lead-free solder characterisation. IEEE Trans. Instrum. Meas., 60 (10). pp. 3444-3450.

Kamara, E*; Lu, H*; Hunt, C; Di Maio, D; Thomas, O (2010) A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects. Microelectron. Reliability, 50 (9-11). pp. 1706-1710.

Vopsaroiu, M; Stanton, T*; Thomas, O; Cain, M G; Thompson, S M* (2009) Infrared metrology for spintronic materials and devices. Meas. Sci. Technol., 20 (4). 045109

Hall, M J; Harmon, S; Patel, H V; Thomas, O (2009) Obtaining the d.c. properties of soft magnetic materials using an open circuit measurement technique. Prz. Elektrotech., 85 (1). pp. 28-30.

Conference or Workshop Item

Samano, A*; Xu, Y*; Harrison, D*; Hunt, C; Wickham, M; Thomas, O (2014) Third harmonic measurement in printed electronics. In: 3rd Asia-Pacific Conference on Antennas and Propagation., 26-29 July 2014, Harbin, China.

Kamara, E*; Lu, H*; Bailey, C*; Thomas, O; Di Maio, D; Hunt, C; Fulton, I (2012) Inverse analysis of solder joint creep properties. In: 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 13-16 August 2012, Guilin, China.

Hunt, C P; Wickham, M; Thomas, O; Zou, L (2010) Assessment of moisture content measurement methods for printed circuit boards. In: Annual IPC International Conference for Electronics Board Design and Manufacture and Assembly., 6-8 April 2010, Las Vegas, USA.

Kamara, E*; Hua Lu*,; Bailey, C*; Hunt, C; Di Maio, D; Thomas, O (2010) Computer simulation and design of a solder joint vibration test machine. In: 11th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 26-28 April 2010, Bordeaux, France.

Shishido, N*; Kanno, T*; Kawahara, S*; Ikeda, T*; Miyazaka, N*; Lu, H*; Bailey, C*; Thomas, O; Di Maio, D; Hunt, C (2010) An analysis of local deformation of SnAgCu solder joint using digital image correlation. In: 2010 11th International Conference on Electronic Pakaging Techology and High Density Packaging., 16-19 August 2010, Xi'an.

Di Maio, D; Murdoch, C*; Thomas, O; Hunt, C (2010) The degradation of solder joints under high current density and low-cycle fatigue. In: 11th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 26-28 April 2010, Bordeaux, France.