Report/Guide

Zou, L; Lea, D; Hunt, C (2004) Solderability testing of surface mount components and PCB pads. Measurement Good Practice Guide. 66

Lea, D; Dusek, M; Jonck, F; Hunt, C (2001) Solderability of electrical components and copper using lead-free alloys. NPL Report. CMMT(A)284

Wickham, M; Lea, D; Nottay, J; Hunt, C (2001) Processability of lead-free component termination materials. NPL Report. MATC(A)47

Lea, D; Jonak, F; Hunt, C (2001) Solderability measurements of PCB pad finishes and geometries. NPL Report. MATC(A)3

Green, S; Lea, D; Hunt, C (1999) Solderability measurements with lead-free alloys. NPL Report. CMMT(A)213

Article

Hunt, C; Lea, D; Adams, S M*; Stratton, P F* (2002) Inert research for lead-free soldering. Electron. Manuf. Test (Aug). pp. 9-10.

Conference or Workshop Item

Adams, S M*; Hunt, C; Lea, D (2002) Wetting balance evaluations of the solderability of lead-free solders. In: European Microelectronics Packaging and Interconnection Symposium. IMAPS Europe, 16-18 June 2002, Cracow, Poland.