Lea, C (2003) Broadband; broad coverage. Global SMT & Packaging, 3 (2). p. 8.

Lea, C (2003) Last year's gadgets; this year's scrap. Global SMT & Packaging, 3 (1). pp. 7-8.

Lea, C (2002) The E-marketplace and supple chain efficiencies. Global SMT & Packaging, 2 (2). pp. 7-8.

Lea, C (2002) End of life strategies. Global SMT & Packaging, 2 (5). p. 7.

Lea, C (2002) Making a difference. Global SMT & Packaging, 2 (Septem). p. 4.

Lea, C (2002) Networking and collaboration. Global SMT & Packaging, 2 (3). 6 and 8

Lea, C (2002) Printing and dispensing. Global SMT & Packaging, 2 (8). p. 8.

Lea, C (2002) SMARTies in Brighton. Global SMT & Packaging, 2 (9). p. 7.

Lea, C (2002) Trains, planes, photonics and E-business. Global SMT & Packaging, 2 (7). p. 8.

Lea, C (2002) Who pays; who makes money; from being green? Global SMT & Packaging, 2 (1). p. 8.

Lea, C (2002) The ascent of the technological society. Global SMT & Packaging, 2 (4). p. 8.

Lea, C (2001) Lead-ing lead-free. Global SMT and Packaging, 1 (1). pp. 3-4.

Lea, C (2001) New thoughts on SIR: underpinning standards with science. Global SMT & Packaging, 1 (4). p. 8.

Lea, C (2001) Optimism in pre-competive research. Global SMT & Packaging, 1 (3). 8, 14.

Lea, C (2001) Traceability of decision making. Global SMT & Packaging, 1 (2). pp. 18-19.

Lea, C (1995) Ozone-depleting solvents: out of time, out of chances, out of business? Finishing, 19 (April). 22 - 24

Lea, C (1994) Feasible cleaning. Electron. Manuf. Test, 10. 22 - 24

Lea, C (1993) Solderability and its measurement. Eng. Sci. Educ. J., 2 (2). pp. 77-84.