Lea, C (2001) New thoughts on SIR: underpinning standards with science. Global SMT & Packaging, 1 (4). p. 8.

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Item Type:	Article
Subjects:	Advanced Materials Advanced Materials > Electronics Interconnection
Last Modified:	02 Feb 2018 13:17
URI:	http://eprintspublications.npl.co.uk/id/eprint/2323

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