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Items where Author is "Di Maio, D"

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Number of items: 19.

Report/Guide

Hunt, C P; Di Maio, D (2009) Allotropic transformation in tin and lead free solder alloys: Measuring the effect and implications for industry. NPL Report. MAT 35

Di Maio, D; Hunt, C P; Willis, B (2008) Reduce copper dissolution in lead-free assembly. Measurement Good Practice Guide. 110

Di Maio, D; Willis, B; Hunt, C (2008) Measurements of copper dissolution in lead-free solder alloys. NPL Report. MAT 26

Di Maio, D; Hunt, C (2008) Investigation methods of the beta to alpha tin allotropic transformation. NPL Report. MAT 21

Di Maio, D; Hunt, C (2007) High-frequency vibration tests of Sn-Pb and lead-free solder joints. NPL Report. MAT 2

Article

Di Maio, D; Thomas, O; Dusek, M; Hunt, C P (2011) Novel testing instrument for lead-free solder characterisation. IEEE Trans. Instrum. Meas., 60 (10). pp. 3444-3450.

Di Maio, D; Hunt, C (2011) On the absence of the beta to alpha Sn allotropic transformation in solder joints made from paste and metal powder. Microelectron. Eng., 88 (1). pp. 117-120.

Monclus, M A; Young, T J; Di Maio, D (2010) AFM indentation method used for elastic modulus characterization of interfaces and thin layers. J. Mater. Sci., 45 (12). pp. 3190-3197.

Di Maio, D; Hunt, C (2010) Time-Lapse photography of the beta-Sn/alpha-Sn allotropic transformation. J. Mater. Sci., Mater. Electron., 20 (4). pp. 386-391.

Kamara, E*; Lu, H*; Hunt, C; Di Maio, D; Thomas, O (2010) A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects. Microelectron. Reliability, 50 (9-11). pp. 1706-1710.

Di Maio, D; Hunt, C (2009) Monitoring the growth of the a phase in tin alloys by electrical resistance measurements. J. Electorn. Mater., 38 (9). pp. 1874-1880.

Di Maio, D; Hunt, C P (2009) On the factors affecting the dissolution of copper in molten lead-free solders and development of a method to assess the soldering parameters. Solder. Surf. Mount Technol., 21 (4). pp. 24-31.

Di Maio, D; Hunt, C (2009) Time-Lapse photography of the beta-Sn/alpha-Sn allotropic transformation. J. Mater. Sci., Mater. Electron., 20 (4). pp. 386-391.

Conference or Workshop Item

Kamara, E*; Lu, H*; Bailey, C*; Thomas, O; Di Maio, D; Hunt, C; Fulton, I (2012) Inverse analysis of solder joint creep properties. In: 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 13-16 August 2012, Guilin, China.

Kamara, E*; Hua Lu*,, ; Bailey, C*; Hunt, C; Di Maio, D; Thomas, O (2010) Computer simulation and design of a solder joint vibration test machine. In: 11th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 26-28 April 2010, Bordeaux, France.

Shishido, N*; Kanno, T*; Kawahara, S*; Ikeda, T*; Miyazaka, N*; Lu, H*; Bailey, C*; Thomas, O; Di Maio, D; Hunt, C (2010) An analysis of local deformation of SnAgCu solder joint using digital image correlation. In: 2010 11th International Conference on Electronic Pakaging Techology and High Density Packaging., 16-19 August 2010, Xi'an.

Di Maio, D; Murdoch, C*; Thomas, O; Hunt, C (2010) The degradation of solder joints under high current density and low-cycle fatigue. In: 11th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 26-28 April 2010, Bordeaux, France.

Hunt, C; Di Maio, D (2009) A test methodology for copper dissolution in lead-free alloys. In: Annual IPC International Conference for Electronic Board Design and Manufacture, and assembly (IPC APEX 2009)., 31 March - 2 April 2009, Las Vegas, USA.

Di Maio, D; Hunt, C P (2008) High-frequency vibration tests of Sn-Pb and lead-free solder joints. In: ESTC 2008: 2nd Electronics System-integration Technology Conference Proceedings, 2008.

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