Huang, Z H*; Xiong, H*; Wu, Z Y*; Conway, P*; Davies, H; Dinsdale, A T; En, Y F*; Zeng, Q F* (2014) Microstructure-based multiphysics modeling for semiconductor integration and packaging. Chin. Sci. Bull., 59 (15). pp. 1696-1708.

He, B*; Petzing, J*; Webb, P*; Conway, P*; Leach, R K (2012) The use of areal surface texture parameters to characterize the mechanical bond strength of copper on glass plating applications. NPL Report. ENG 34

Selviah, D R*; Walker, A C*; Hutt, D A*; Wang, K*; McCarthy, A*; Fernandez, E A*; Papakonstantinou, I*; Baghsiahi, H*; Suyal, H*; Taghizadeh, M*; Conway, P*; Chappell, J*; Zakariyah, S S*; Milward, D*; Pitwon, R*; Hopkins, K*; Muggeridge, M*; Rygate, J*; Calver, J*; Kandulski, W*; Deshazer, D J*; Hueston, K*; Ives, D J; Ferguson, R; Harris, S; Hinde, G*; Cole, M*; White, H*; Suyal, N*; Rehman, H U*; Bryson, C* (2010) Integrated optical and electronic interconnect PCB manufacturing research. Circuit World, 36 (2). pp. 5-19.