He, B*; Petzing, J*; Webb, P*; Conway, P*; Leach, R K (2012) The use of areal surface texture parameters to characterize the mechanical bond strength of copper on glass plating applications. NPL Report. ENG 34

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Abstract

This report describes research into the role that surface topography plays in influencing the
mechanical bond strength of the electroless copper plating of novel glass substrates. The
work considers bespoke laser machining of glass substrates, electroless plating chemistry,
areal surface topography analysis using non-contact optical techniques, paramaterization of
the surfaces using areal parameters described in ISO 25178, and scratch testing of plated
copper to measure the adhesive bond strength. By correlating bond strength to appropriate
areal parameters, it is anticipated that better mechanical adhesive potential of machined
glass surfaces can be achieved.

Item Type:	Report/Guide (NPL Report)
NPL Report No.:	ENG 34
Subjects:	Engineering Measurements Engineering Measurements > Dimensional
Last Modified:	02 Feb 2018 13:14
URI:	http://eprintspublications.npl.co.uk/id/eprint/5350

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