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Integrated optical and electronic interconnect PCB manufacturing research.

Selviah, D R*; Walker, A C*; Hutt, D A*; Wang, K*; McCarthy, A*; Fernandez, E A*; Papakonstantinou, I*; Baghsiahi, H*; Suyal, H*; Taghizadeh, M*; Conway, P*; Chappell, J*; Zakariyah, S S*; Milward, D*; Pitwon, R*; Hopkins, K*; Muggeridge, M*; Rygate, J*; Calver, J*; Kandulski, W*; Deshazer, D J*; Hueston, K*; Ives, D J; Ferguson, R; Harris, S; Hinde, G*; Cole, M*; White, H*; Suyal, N*; Rehman, H U*; Bryson, C* (2010) Integrated optical and electronic interconnect PCB manufacturing research. Circuit World, 36 (2). pp. 5-19.

Full text not available from this repository.

Abstract

The purpose of this paper is to provide an overview of the research in a project aimed at developing manufacturing techniques for integrated optical and electronic interconnect printed circuit boards (OPCB) including the motivation for this research, the progress, the achievements and the interactions between the partners.

Item Type: Article
Keywords: opcb, optical backplane, interconnects
Subjects: Optical Radiation and Photonics
Optical Radiation and Photonics > Optical Comms. And Data
Last Modified: 02 Feb 2018 13:15
URI: http://eprintspublications.npl.co.uk/id/eprint/4753

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