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Microstructure-based multiphysics modeling for semiconductor integration and packaging.

Huang, Z H*; Xiong, H*; Wu, Z Y*; Conway, P*; Davies, H; Dinsdale, A T; En, Y F*; Zeng, Q F* (2014) Microstructure-based multiphysics modeling for semiconductor integration and packaging. Chin. Sci. Bull., 59 (15). pp. 1696-1708.

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Semiconductor technology and packaging is advancing quickly towards system integration where the packaging is co-designed and co-manufactured along with wafer fabrication. Electronics manufacturing is a highly dynamic industry largely driven by consumer oriented portable electronic products, where time-to-market is critical and modeling and simulation approaches have been routinely adopted. However, materials issues, e.g. mesoscale microstructure, have to date been excluded in the integrated product design cycle due to the myriad of materials used and the complex nature of the material phenomena occurring in these electronic packages. Three-dimensional system integration is one strategy to resolve the conventional CMOS scaling limits; however, the dimensions of the packaging materials have shrunk to the mesoscale. It is natural to expect that the Materials Genome Initiative (MGI) and Integrated Computational Materials Engineering (ICME) recently launched in the United States could play a key role to better enable the integration of materials information, captured in computational tools, with engineering product performance analysis and manufacturing process simulation. This paper highlights the application of the MGI and ICME approaches for the study of the ultrafine interconnects used in semiconductor integration and packaging. An emphasis is placed on mesoscale microstructure and microstructural evolution under effects from muti-physics fields, i.e. specifically the mechanical and electrical fields. Techniques for retrieving the essential microstructural characteristics and establishing linkages to packaging performance are discussed in this paper. High performance computing issues to enable an ICME platform for semiconductor integration and packaging has also been highlighted.

Item Type: Article
Subjects: Advanced Materials
Advanced Materials > Materials Modelling
Identification number/DOI: 10.1007/s11434-013-0103-7
Last Modified: 02 Feb 2018 13:13
URI: http://eprintspublications.npl.co.uk/id/eprint/6205

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