Turnbull, A; Maxwell, A S; Pillai, S; White, J R (2025) Measurement of residual stress in polymeric mouldings. Measurement Good Practice Guide. 10 (Issue 2)
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Text (Measurement Good Practice Guide No 10)
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Official URL: https://doi.org/10.47120/npl.mgpg10
Abstract
Thermoplastic polymer mouldings and thermoset mouldings often contain residual stresses which can cause distortion and may influence the fracture behaviour. This guide describes approaches to measurement of residual stress using layer removal, hole-drilling and chemical probe techniques. It will be of particular value to polymer processors, designers and materials testers.
| Item Type: | Report/Guide (Measurement Good Practice Guide) |
|---|---|
| Notes: | NPL made every effort to ensure all information contained in this Good Practice Guide was correct at time of publication. NPL is not responsible for any errors, omissions or obsolescence, and does not accept any liability arising from the use of these Good Practice Guides. |
| Subjects: | Advanced Materials Advanced Materials > Polymers Advanced Materials > Mechanical Measurement |
| Identification number/DOI: | 10.47120/npl.mgpg10 |
| Last Modified: | 20 Feb 2026 13:28 |
| URI: | https://eprintspublications.npl.co.uk/id/eprint/1567 |
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