Turnbull, A; Maxwell, A S; Pillai, S; White, J R (2025) Measurement of residual stress in polymeric mouldings. Measurement Good Practice Guide. 10 (Issue 2)
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Text (Measurement Good Practice Guide No 10)
MGPG 10.pdf - Published Version Download (1MB) | Preview |
Official URL: https://doi.org/10.47120/npl.mgpg10
Abstract
Thermoplastic polymer mouldings and thermoset mouldings often contain residual stresses which can cause distortion and may influence the fracture behaviour. This guide describes approaches to measurement of residual stress using layer removal, hole-drilling and chemical probe techniques. It will be of particular value to polymer processors, designers and materials testers.
Item Type: | Report/Guide (Measurement Good Practice Guide) |
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Subjects: | Advanced Materials Advanced Materials > Polymers Advanced Materials > Mechanical Measurement |
Identification number/DOI: | 10.47120/npl.mgpg10 |
Last Modified: | 10 Mar 2025 09:13 |
URI: | http://eprintspublications.npl.co.uk/id/eprint/1567 |
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