He, B*; Petzing, J N*; Webb, D P*; Conway, P P*; Leach, R K (2012) The assessment of areal surface texture parameters for characterizing the adhesive bond strength of copper plated micro-machined glass. In: 12th euspen International Conference, 4-8 June 2012, Stockholm, Sweden.
Full text not available from this repository.| Item Type: | Conference or Workshop Item (UNSPECIFIED) |
|---|---|
| Subjects: | Engineering Measurements Engineering Measurements > Dimensional |
| Last Modified: | 02 Feb 2018 13:14 |
| URI: | https://eprintspublications.npl.co.uk/id/eprint/5467 |
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