He, B*; Webb, D P*; Petzing, J*; Leach, R K (2011) Improving plated copper adhesion for metallisation of glass PCBs. In: International Conference on Electronic Packaging Technology and High Density packageing 2011 (ICEPT-HDP2011), 8-11 August 2011, Shanghai, China.

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Item Type:	Conference or Workshop Item (UNSPECIFIED)
Subjects:	Engineering Measurements Engineering Measurements > Dimensional
Last Modified:	02 Feb 2018 13:14
URI:	https://eprintspublications.npl.co.uk/id/eprint/5220