Robinson, A D; Leach, R K (2008) Overview of tomography techniques to measure wafer thickness in MEMS structures. NPL Report. ENG 8
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Abstract
This report investigates possible metrology solutions to the industrial requirement for the measurement of the wafer thickness and internal structure of MEMS sensors. A range of optical and electrical techniques were reviewed and the report recommends optical coherence tomography as the most suitable technique. Optical coherence tomography is considered from a theoretical perspective and a range of system designs and commercially available instruments are discussed, including some images of a MEMS sensor as proof of concept. Finally recommendations are made for further research in image processing in order to obtain sub-micrometre axial resolution for MEMS measurement.
Item Type: | Report/Guide (NPL Report) |
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NPL Report No.: | ENG 8 |
Keywords: | MEMS, tomography, thickness |
Subjects: | Engineering Measurements Engineering Measurements > Dimensional |
Last Modified: | 02 Feb 2018 13:15 |
URI: | http://eprintspublications.npl.co.uk/id/eprint/4207 |
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