Conference or Workshop Item

Rajaguru, P*; Stoyanov, S*; Tang, Y K*; Bailey, C*; Claverley, J; Leach, R K; Topham, D* (2010) Numerical modelling methodology for design of miniaturised integrated products - an application to 3D CMM micro-probe development. In: 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiements in Microelectronics and Microsystems (EuroSimE 2010)., 26-28 April 2010, Bordeaux, France.

Stoyanov, S*; Rajagura, P*; Tang, Y K*; Bailey, C*; Claverley, J; Leach, R K (2010) Reduced order modelling for risk mitigation in design of miniaturised/integrated products. In: 33rd International Spring Seminar on Electronics Technology, 12-16 May 2010, Warsaw, Poland.

Stoyanov, S*; Bailey, C*; Leach, R K; Hughes, B; Wilson, A; O'Neill, W*; Dorey, R A*; Shaw, C*; Underhill, D*; Almond, H J* (2008) Modelling and prototyping the conceptual design of 3D CMM micro-probe. In: 2nd Electronics Systemintegration Technology Conference, 2008, Greenwich, UK.