Article

Kamara, E*; Lu, H*; Hunt, C; Di Maio, D; Thomas, O (2010) A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects. Microelectron. Reliability, 50 (9-11). pp. 1706-1710.

Conference or Workshop Item

Kamara, E*; Lu, H*; Bailey, C*; Thomas, O; Di Maio, D; Hunt, C; Fulton, I (2012) Inverse analysis of solder joint creep properties. In: 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 13-16 August 2012, Guilin, China.

Kamara, E*; Hua Lu*,; Bailey, C*; Hunt, C; Di Maio, D; Thomas, O (2010) Computer simulation and design of a solder joint vibration test machine. In: 11th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 26-28 April 2010, Bordeaux, France.