Report/Guide

He, B*; Petzing, J*; Webb, P*; Conway, P*; Leach, R K (2012) The use of areal surface texture parameters to characterize the mechanical bond strength of copper on glass plating applications. NPL Report. ENG 34

Conference or Workshop Item

He, B*; Petzing, J N*; Webb, D P*; Conway, P P*; Leach, R K (2012) The assessment of areal surface texture parameters for characterizing the adhesive bond strength of copper plated micro-machined glass. In: 12th euspen International Conference, 4-8 June 2012, Stockholm, Sweden.

He, B*; Webb, D P*; Petzing, J*; Leach, R K (2011) Improving plated copper adhesion for metallisation of glass PCBs. In: International Conference on Electronic Packaging Technology and High Density packageing 2011 (ICEPT-HDP2011), 8-11 August 2011, Shanghai, China.