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Items where Author is "Gourlay, C M"

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Article

Gu, T; Tong, V S; Gourlay, C M; Britton, T B (2020) In-situ study of creep in Sn-3Ag-0.5Cu solder. Acta Materialia, 196. pp. 31-43. ISSN 13596454

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