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In-situ study of creep in Sn-3Ag-0.5Cu solder

Gu, T; Tong, V S; Gourlay, C M; Britton, T B (2020) In-situ study of creep in Sn-3Ag-0.5Cu solder. Acta Materialia, 196. pp. 31-43. ISSN 13596454

Full text not available from this repository.
Item Type: Article
Subjects: Advanced Materials > Microstructural Characterisation
Divisions: Engineering
Identification number/DOI: 10.1016/j.actamat.2020.06.013
Last Modified: 26 Oct 2020 15:30
URI: http://eprintspublications.npl.co.uk/id/eprint/8933

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