Gu, T; Tong, V S; Gourlay, C M; Britton, T B (2020) In-situ study of creep in Sn-3Ag-0.5Cu solder. Acta Materialia, 196. pp. 31-43. ISSN 13596454
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Official URL: https://doi.org/10.1016/j.actamat.2020.06.013
Item Type: | Article |
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Subjects: | Advanced Materials > Microstructural Characterisation |
Divisions: | Engineering |
Identification number/DOI: | 10.1016/j.actamat.2020.06.013 |
Last Modified: | 26 Oct 2020 15:30 |
URI: | http://eprintspublications.npl.co.uk/id/eprint/8933 |
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