We use cookies to ensure that we give you the best experience on our website Learn more
Huang, Z H*; Xiong, H*; Wu, Z Y*; Conway, P*; Davies, H; Dinsdale, A T; En, Y F*; Zeng, Q F* (2014) Microstructure-based multiphysics modeling for semiconductor integration and packaging. Chin. Sci. Bull., 59 (15). pp. 1696-1708.