Zhu, L; Shin, S H; Payapulli, R; Machii, T; Motoyoshi, M; Suematsu, N; Ridler, N M; Lucyszyn, S (2023) 3-D Printed Rectangular Waveguide 123–129 GHz Packaging for Commercial CMOS RFICs. IEEE Microwave and Wireless Technology, 33 (2). pp. 157-160.

Preview

Text eid9833.pdf - Published Version Available under License Creative Commons Attribution. Download (1MB) | Preview

Abstract

This work demonstrates the hybrid integration of a complementary metal–oxide–semiconductor (CMOS) radio frequency integrated circuit (RFIC) into a host 3-D printed metal-pipe rectangular waveguide (MPRWG). On-chip Vivaldi antennas are used for TE10-to-thin-film microstrip (TFMS) mode conversion. Our packaging solution has a combined measured insertion loss of only 1 dB/transition at 126 GHz. This unique packaging and interconnect solution opens up new opportunities for implementing low-cost subterahertz (THz) multichip modules.

Item Type:	Article
Keywords:	3-D printing, additive manufacturing, complementary metal–oxide–semiconductor (CMOS), interconnects, millimeter wave, mode conversion, packaging, radio frequency integrated circuit (RFIC), rectangular waveguide, Vivaldi antenna, WR-6.
Subjects:	Electromagnetics > RF and Microwave
Divisions:	Electromagnetic & Electrochemical Technologies
Identification number/DOI:	10.1109/LMWT.2022.3220364
Last Modified:	25 Sep 2023 13:03
URI:	https://eprintspublications.npl.co.uk/id/eprint/9833