Brewin, A; Zou, L; Hunt, C (2001) Code of practice for dispensing electronic materials. NPL Report. MATC(A)82

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Abstract

Robotic dispensing provides flexibility for electronics production not possible from screen-printing processes. As well as the application of solder paste and surface mount adhesive, dispensing systems are utilised with newer technologies such as the application of conductive adhesives, chip-on-board glob-tops and flip-chip underfills.
This document gives practical guidance for the dispensing of these materials for printed circuit assembly production.

Item Type:	Report/Guide (NPL Report)
NPL Report No.:	MATC(A)82
Keywords:	dispensing, solder paste, adhesive conductive adhesives, chip-on-board glob-tops, flip-chip underfills
Subjects:	Advanced Materials Advanced Materials > Electronics Interconnection
Last Modified:	02 Feb 2018 13:17
URI:	https://eprintspublications.npl.co.uk/id/eprint/2382