Dusek, M; Nottay, J; Hunt, C (2000) The use of shear testing and thermal cycling for assessment of solder joint reliability. NPL Report. CMMT(A)268

Text cmmt268.pdf Download (1MB)

Abstract

No abstract available

Item Type:	Report/Guide (NPL Report)
NPL Report No.:	CMMT(A)268
Subjects:	Advanced Materials Advanced Materials > Electronics Interconnection
Last Modified:	02 Feb 2018 13:17
URI:	https://eprintspublications.npl.co.uk/id/eprint/1606