Manning, L; Robador, A; Skinner, J (2024) Temperature Humidity Bias Testing of a Wafer-Embedded Coplanar Waveguide Line up to 40 GHz. In: 2024 103rd ARFTG Microwave Measurement Conference (ARFTG), 21 June 2024, Washington, DC, USA.

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Abstract

Temperature humidity bias testing using an 85/85 temperature and relative humidity regime with DC bias was conducted on a 3500 µm CPW (coplanar waveguide) delay line embedded on an alumina‑based Formfactor ISS (impedance substrate standard) wafer circuit to assess performance degradation due to corrosion generated from electrochemical processes. The setup for this experiment is detailed and discussion of the important background theory is given. Initial results from the testing are presented as both surface insulation resistance (SIR) measurements and S‑parameter measurements. It was observed that the temperature humidity bias testing gave rise to electrochemical corrosion, including the growth of gold dendrites, within the ISS. Corrosion impacted the performance of the wafer circuit, giving rise to higher insertion loss and phase constant. Insertion loss degraded by approximately 200 % at 40 GHz due to the corrosion.

Item Type:	Conference or Workshop Item (Paper)
Subjects:	Electromagnetics > Electrical Measurement
Divisions:	Electromagnetic & Electrochemical Technologies
Publisher:	IEEE
Identification number/DOI:	10.1109/ARFTG61196.2024.10660883
Last Modified:	16 Feb 2026 10:53
URI:	https://eprintspublications.npl.co.uk/id/eprint/10277