Lord, J D; Nimmo, W; Cooper, D*; Morrell, R (1997) Strain gauge techniques for measuring thermal expansion. NPL Report. CMMT(A)68

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Abstract

A novel strain gauge technique for measuring thermal expansion and dimensional change is discussed. The technique has been used to measure the thermal expansion coefficient of a number of materials including copper, aluminium and both polymer and metal matrix composites. Copper and aluminium were used for calibration purposes and validation of the technique. Values obtained from the strain gauge method for the thermal expansion coefficient, between 25-100°C, of copper and aluminium were 16.6 and 23.4 x 10-6/°C respectively and these are in good agreement with typical handbook values.
Data from particulate reinforced MMCs are discussed and compared with conventional dilatometry. Also presented are results from thermal cycling tests on a variety of polymer composites. With some of these materials, in addition to measuring the traditional thermal expansion behaviour, the strain gauge method allows the dimensional changes which develop during processing (cure and postcure) of the material to be monitored. The behaviour measured is in good agreement with predicted behaviour.
More general issues relating to the practical aspects of the technique are discussed also. The report describes the work carried out by NPL in Project DCC2 and meets one of the deliver abIes of the project.

Item Type:	Report/Guide (NPL Report)
NPL Report No.:	CMMT(A)68
Subjects:	Advanced Materials Advanced Materials > Mechanical Measurement Advanced Materials > Thermal Performance
Last Modified:	02 Feb 2018 13:18
URI:	http://eprintspublications.npl.co.uk/id/eprint/754

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