Seah, M P (2012) Topography effects and monatomic ion sputtering of undulating surfaces, particles and large nanoparticles: Sputtering yields, effective sputter rates and topography evolution. Surf. Interface Anal., 44 (2). pp. 208-218.

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Abstract

An analysis is provided of the change in topography and consequent apparent change in sputtering yields of surfaces as a result of ion sputtering using Yamamura et al's model for the angular dependence of the sputtering yield for monatomic primary ions. This is extended to provide a general scheme for any monatomic primary ion and any amorphous elemental solid target. Details are provided of the topographic changes for surfaces with an undulating, cosine, profile sputtered with primary ions normal to, and at 45° to, the average surface and also for spherical particles. Smoothing occurs at normal incidence and both smoothening and roughening can occur at 45°. Predictions show how the sputtering rate of the material varies with the depth sputtered as a result of the topographical changes, the rate either increasing or decreasing. The effect of roughening usually increases the sputtering rate with values increasing up to 4 times. The effect of sample rotation is a fast smoothing. Conditions are described for the optimal profiling of particles with a layered structure and calculated profiles are evaluated. The effect of rotation on particles is discussed in relation to different instrumental geometries. In this work, recoil mixing, re-deposition, diffusion and the topographic effects at the size of the individual ion cascade are ignored.

Item Type:	Article
Keywords:	depth resolution, sputtering, sputter depth profiles, sputtering yield, topography
Subjects:	Nanoscience Nanoscience > Surface and Nanoanalysis
Identification number/DOI:	10.1002/sia.3798
Last Modified:	02 Feb 2018 13:14
URI:	http://eprintspublications.npl.co.uk/id/eprint/5386

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