Rides, M; Duncan, B (2005) Correlating physical properties of adhesives with process and bonding performance. NPL Report. DEPC-MPR 018

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Abstract

This report presents a summary of the test methods and results covering density, surface tension and contact angle, rheological properties, tack and bond performance for a range of hot melt adhesives, and a summary assessment of the processibility of those materials. A number of correlations between physical properties and process and bond performance have been identified. In particular, the following correlations - in some cases strong correlations - have been identified:

Item Type:	Report/Guide (NPL Report)
NPL Report No.:	DEPC-MPR 018
Keywords:	hot melt, surface tension, rheology
Subjects:	Advanced Materials Advanced Materials > Adhesives
Last Modified:	02 Feb 2018 13:16
URI:	http://eprintspublications.npl.co.uk/id/eprint/3276

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