Tomlins, P E; Levoguer, C (1999) An introduction to electrically conductive adhesives and their current applications. NPL Report. CMMT(A)243

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Abstract

Conducting adhesives have been adopted in niche markets that require high levels of interconnection density. Typically conducting adhesives have been used in hybrid technology, die-attach and display assemblies. These materials offer a more environmentally acceptable processing route than lead based solders. This feature has helped to raise their profile within the industry as a result of increased environmental concern over lead containing alloys particularly within Europe. This is particularly attractive since these materials can be processed at lower temperatures than lead free metal alloys, an important consideration when manufacturing boards that contain thermally sensitive packages.
In this document we discuss the types of adhesive that are currently available, current applications and their advantages and disadvantages. The requirements for developing or agreeing on appropriate test methods for assessing the performance of these materials during both manufacture and service are particularly highlighted.

Item Type:	Report/Guide (NPL Report)
NPL Report No.:	CMMT(A)243
Subjects:	Advanced Materials Advanced Materials > Adhesives
Last Modified:	02 Feb 2018 13:18
URI:	http://eprintspublications.npl.co.uk/id/eprint/1550

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