Broughton, W R; Mera, R D; Hinopoulos, G (1999) Creep testing of adhesive joints T-peel test. NPL Report. CMMT(A)193

Text CMMT193.pdf Download (287kB)

Abstract

The T-(or 180°) peel test is the most widely used method by industry for determining the relative peel resistance of adhesive bonds between flexible adherends. This test geometry has been adopted by most standards bodies and is widely used by industry to evaluate environmental durability of adhesively bonded systems. The simplicity and low costs associated with specimen manufacture, testing and data analysis has contributed to the widespread use of this method for assessing environmental and creep resistance. A series of tests have been conducted on bonded T-peel joints exposed simultaneously to heat, humidity and load.
This report evaluates the test method for producing in-situ peel strength data on adhesively bonded joints. The test method is evaluated in terms of fitness for purpose in assessing environmental performance and provides a guide to specimen geometry, manufacture and testing. The report also includes an experimental evaluation of a self-stress (spring) loading fixture used for creep testing in hot/humid environments. A number of tools have been employed in data interpretation. These include finite element analysis, statistical techniques, analytical modelling, fractographic analysis, dynamic mechanical thermal analysis and mechanical testing.

Item Type:	Report/Guide (NPL Report)
NPL Report No.:	CMMT(A)193
Subjects:	Advanced Materials Advanced Materials > Adhesives
Last Modified:	02 Feb 2018 13:18
URI:	http://eprintspublications.npl.co.uk/id/eprint/1258

Actions (login required)

View Item