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Creep testing of adhesive joints analysis of creep rupture data.

Broughton, W R (1999) Creep testing of adhesive joints analysis of creep rupture data. NPL Report. CMMT(A)195

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This report examines the combined effect of constant applied load and environmental exposure (i.e. elevated temperature and heat/humidity) on the time-to-failure of adhesively bonded joints. T-peel, thick adherend shear, perforated single-lap and tapered-strap joint configurations are considered. Residual strength/endurance limit data generated within the programme and obtained from industry have been assessed to determine any synergistic effects that may occur between static loading and environmental agents (i.e. temperature and moisture).
Durability data, supplied to the programme by Daimler Benz Forschung und Technik (courtesy of British Aerospace, Sowerby), from the ABHTA “Adhesives Bonding for High Temperature Applications” Brite-Euram Project BE-5104 have been analysed. This work involved the combined effect of mechanical loading and elevated temperature titanium alloy joints bonded with either epoxy FM 350NA or bismaleimide HP655 adhesives. In addition, durability data generated from Project 3 “The Environmental Durability of Adhesive Bonds” of the DTI funded MTS programme ADH were also examined. Data generated within the project. The results of work conducted within the programme on tapered-strap and T-peel joints were also analysed.
The report demonstrates that a systematic approach, albeit empirical, can be used to determine the time-to-failure for different combinations of test variables on different adherend/adhesive/surface treatment combinations. Simple relationships can be used for interpolation purposes to determine failure times for intermediate stress levels. The large uncertainty associated with creep test results, especially those obtained under hot/wet conditions, requires considerably more data points than currently being used to generate full creep rupture curves for design purposes.

Item Type: Report/Guide (NPL Report)
NPL Report No.: CMMT(A)195
Subjects: Advanced Materials
Advanced Materials > Adhesives
Last Modified: 02 Feb 2018 13:18
URI: http://eprintspublications.npl.co.uk/id/eprint/1256

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