Wei, X; Miao, Y; Jin, X; Loh, T H; Liu, G (2024) Design of a Novel SiP Integrated RF Front-end Module Based on SOI Switch and SAW Filter. Sensors, 24 (1). 6994

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Abstract

This paper proposes a novel System-in-Package (SiP) integrated architecture that incorporates Silicon-On-Insulator (SOI) switches and Surface Acoustic Wave (SAW) filters within the chip, aiming to fulfill the demands over their miniaturization and multi-functionality for application in emerging wireless technologies. The proposed architecture not only reduces the integration complexity but also considers the architectural design of the integrated module, impedance matching techniques, and signal integrity for carrier aggregation (CA) technology realisation. The feasibility of employing SOI switches and SAW filters based on SiP design has been vali-dated through the trial production of a Sub-3GHz radio frequency (RF) front-end diversity re-ceiver module. The resulting RF front-end module demonstrates exceptional high packaging density and enhance communication reliability, rendering it suitable for diverse applications in miniaturized RF systems.

Item Type:	Article
Keywords:	SiP integration; CA; diversity acceptance; RF front-end module
Subjects:	Electromagnetics > Wireless Communications
Divisions:	Electromagnetic & Electrochemical Technologies
Identification number/DOI:	10.3390/s24216994
Last Modified:	26 Sep 2025 13:32
URI:	https://eprintspublications.npl.co.uk/id/eprint/10230