Conference or Workshop Item

Shishido, N*; Kanno, T*; Kawahara, S*; Ikeda, T*; Miyazaka, N*; Lu, H*; Bailey, C*; Thomas, O; Di Maio, D; Hunt, C (2010) An analysis of local deformation of SnAgCu solder joint using digital image correlation. In: 2010 11th International Conference on Electronic Pakaging Techology and High Density Packaging., 16-19 August 2010, Xi'an.