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Items where Author is "Fulton, I"
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Conference or Workshop Item
Kamara, E*; Lu, H*; Bailey, C*; Thomas, O; Di Maio, D; Hunt, C; Fulton, I (2012) Inverse analysis of solder joint creep properties. In: 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 13-16 August 2012, Guilin, China.