Yu, Y; Wang, Y; Skaik, T; Starke, T; Shang, X; Lancaster, M J; Hunyer, P; Huggard, P G; Wang, H; Harris, M; Beardsley, M; Cheng, Q S (2022) D-band Waveguide Diplexer Fabricated Using Micro Laser Sintering. IEEE Transactions on Components, Packaging and Manufacturing, 12 (9). pp. 1446-1457.

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Abstract

D-band (110 to 170 GHz) has been proposed for applications in backhaul links for 5G and beyond and is used, for example, in space-based receivers for earth observation. We report on a D-band waveguide diplexer, with two passbands of 130-134GHz and 151.5-155.5GHz, fabricated using micro laser sintering (MLS) additive manufacturing with stainless-steel alloy. The stainless-steel component was plated with gold for performance improvement. The diplexer, designed using coupling matrix theory, employs an all-resonator, E-plane split block, structure. Two channels of the diplexer are folded to realize a compact size. A staircase coupled structure is implemented in one channel to increase the isolation performance. The waveguide flanges are modified to adapt to the limited printing volume from the MLS process. Effects of fabrication tolerance on the diplexer are presented. The measured average insertion losses, within the bandwidths of 4 GHz, are 1.31 dB and 1.37 dB respectively. Respective frequency shifts from design values are 0.92% and 1.1%, and bandwidth variations are 4% and 15%. The work demonstrates MLS to be a promising fabrication technique for complex waveguide devices at sub-THz frequency range.

Item Type:	Article
Subjects:	Electromagnetics > RF and Microwave
Divisions:	Electromagnetic & Electrochemical Technologies
Identification number/DOI:	10.1109/TCPMT.2022.3204887
Last Modified:	16 Feb 2024 11:45
URI:	https://eprintspublications.npl.co.uk/id/eprint/9930