Koo, H; Salter, M J; Hong, Y P (2018) Improved S-Parameter Measurements of Embedded Planar Transmission-Line on Multi-Layer PCB. In: 2018 Conference on Precision Electromagnetic Measurements (CPEM 2018), 8-13 July 2018, Paris, France.

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Abstract

This paper describes improved calibration method for measuring the scattering parameters of an embedded planar transmission line on multi-layer printed circuit board (PCB) substrate from 100 MHz to 40 GHz. When using a Vector Network Analyzer (VNA) to measure the scattering parameters (S-parameters) of printed circuit board (PCB) interconnects, it can be advantageous to include the calibration and verification standards on the same PCB as the interconnects under test. Both designs of on-PCB standards and calibrated results of verification standards are presented.

Item Type:	Conference or Workshop Item (Paper)
Keywords:	multi-layer PCB, planar transmission-line, S-parameter measurement, TRL calibration
Subjects:	Electromagnetics > RF and Microwave
Divisions:	Engineering, Materials & Electrical Science
Identification number/DOI:	10.1109/CPEM.2018.8500818
Last Modified:	10 Jan 2019 14:36
URI:	http://eprintspublications.npl.co.uk/id/eprint/8223

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