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International round-robin study of the thermoelectric transport properties of an n-type half-heusler compound from 300 K to 773 K.

Wang, H S*; Bai, S Q*; Chen, L D*; Cuenat, A; Joshi, G*; Kleinke, H*; Konig, J*; Lee, H W*; Martin, J*; Oh, M W*; Porter, W D*; Ren, Z F*; Salvador, J*; Sharp, J*; Taylor, P*; Thompson, A J*; Tseng, Y C* (2015) International round-robin study of the thermoelectric transport properties of an n-type half-heusler compound from 300 K to 773 K. J. Electorn. Mater., 44 (11). pp. 4482-4491.

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Abstract

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Item Type: Article
Subjects: Advanced Materials
Advanced Materials > Electrochemistry
Identification number/DOI: 10.1007/s11664-015-4006-z
Last Modified: 02 Feb 2018 13:13
URI: http://eprintspublications.npl.co.uk/id/eprint/6845

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