Kamara, E*; Lu, H*; Bailey, C*; Thomas, O; Di Maio, D; Hunt, C; Fulton, I (2012) Inverse analysis of solder joint creep properties. In: 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 13-16 August 2012, Guilin, China.

Full text not available from this repository.

Abstract

No abstract available

Item Type:	Conference or Workshop Item (UNSPECIFIED)
Subjects:	Electromagnetics Electromagnetics > Electrical Measurement
Identification number/DOI:	101109/ICEPT-HDP.2012.6476417
Last Modified:	02 Feb 2018 13:14
URI:	https://eprintspublications.npl.co.uk/id/eprint/5775