Kroupa, A*; Andersson, D*; Hoo, N*; Pearce, J*; Watson, A*; Dinsdale, A T (2012) Current problems and possible solutions in high-temperature lead-free soldering. J. Mater. Eng. Perform., 21 (5). pp. 629-637.

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Abstract

The substitution of lead in the electronics industry is one of the key issues in the current drive towards ecological manufacturing. Legislation has already banned the use of lead in solders for mainstream applications (TM < 220 °C), but the use of lead in the solders for high temperature applications (> 85% lead, TM < 250-350°C) is still exempt in RoHS2. The search for proper substitutes has been ongoing among solder manufacturers only for a decade without finding a viable low cost alternative and is the subject of intensive research.
This paper tries to map the current situation in the field of high-temperature lead-free soldering, presenting a short review of current legislation, requirements for substitute alloys and finally, it describes some existing solutions both in the field of promising new materials and new technologies. Currently, there is no drop-in replacement for lead-containing solders and therefore both new materials and new technologies may be viable solutions for production of reliable lead-free joints for high temperature applications

Item Type:	Article
Subjects:	Advanced Materials Advanced Materials > Thermodynamics
Identification number/DOI:	10.1007/s11665-012-0125-3
Last Modified:	02 Feb 2018 13:14
URI:	http://eprintspublications.npl.co.uk/id/eprint/5498

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