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Fatigue damage prediction during thermo-mechanical cycling for lead-free solders.

Dusek, M; Hunt, C (2008) Fatigue damage prediction during thermo-mechanical cycling for lead-free solders. In: ESTC 2008: 2nd Electronics System-integration Technology Conference Proceedings, 2008.

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Abstract

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Item Type: Conference or Workshop Item (UNSPECIFIED)
Subjects: Advanced Materials
Advanced Materials > Electronics Interconnection
Last Modified: 02 Feb 2018 13:15
URI: https://eprintspublications.npl.co.uk/id/eprint/5096
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