Dusek, M; Hunt, C (2005) Creep rates and stress relaxation for micro-sized lead-free solder joints. NPL Report. DEPC-MN 021

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Item Type:	Report/Guide (NPL Report)
NPL Report No.:	DEPC-MN 021
Subjects:	Advanced Materials Advanced Materials > Electronics Interconnection
Last Modified:	02 Feb 2018 13:16
URI:	https://eprintspublications.npl.co.uk/id/eprint/3253