Zou, L; Lea, D; Hunt, C (2004) Solderability testing of surface mount components and PCB pads. Measurement Good Practice Guide. 66

Text (Measurement Good Practice Guide No. 66) mgpg66.pdf - Published Version Download (353kB)

Abstract

This document guides you to choose the correct test parameter settings for solderability testing of different type and size surface mount components and PCB pads. Pass/fail criteria are suggested and examples of good and bad solderability curves for each type component and PCB pad are given in the document to help you to judge the solderability of test component.

Item Type:	Report/Guide (Measurement Good Practice Guide)
Notes:	NPL made every effort to ensure all information contained in this Good Practice Guide was correct at time of publication. NPL is not responsible for any errors, omissions or obsolescence, and does not accept any liability arising from the use of these Good Practice Guides.
Subjects:	Advanced Materials Advanced Materials > Electronics Interconnection
Last Modified:	23 Feb 2026 09:49
URI:	https://eprintspublications.npl.co.uk/id/eprint/2952