Evans, H E*; Nicholls, J R*; Saunders, S R J (1995) The influence of diffusion-related mechanisms in limiting oxide-scale failure. Solid State Phenomena, 41. pp. 137-156.

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Abstract

Mechanical damage to thin, protective oxide layers arises principally in service from differential strains produced by temperature changes. For typical alumina- or chromia-forming alloys, in-plane tensile stresses are produced during cooling. Imposed strain rates can vary over many orders of magnitude and, since these are applied at high temperatures, the possibility exists that diffusional relaxation processes (generally termed 'creep') will reduce the development of high stresses within the oxide or at the oxide/metal interface and, thus, have a beneficial influence on the processes of scale failure. This aspect is considered in detail in this paper both by reviewing published data and by presenting new numerical results on the influence of metal creep strength on the growth characteristics of an interfacial crack. In general, it is shown that diffusional relaxation can be important but that its contribution will depend on the intrinsic creep properties of the phase concerned and also on the values of imposed strain rate and temperature.

Item Type:	Article
Keywords:	oxide-scale cracking, spallation, interfacial crack growth, creep relaxation
Subjects:	Advanced Materials
Last Modified:	02 Feb 2018 13:19
URI:	http://eprintspublications.npl.co.uk/id/eprint/2433

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