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The assessment of areal surface texture parameters for characterizing the adhesive bond strength of copper plated micro-machined glass.

He, B*; Petzing, J N*; Webb, D P*; Conway, P P*; Leach, R K (2012) The assessment of areal surface texture parameters for characterizing the adhesive bond strength of copper plated micro-machined glass. In: 12th euspen International Conference, 4-8 June 2012, Stockholm, Sweden.

Full text not available from this repository.
Item Type: Conference or Workshop Item (UNSPECIFIED)
Subjects: Engineering Measurements
Engineering Measurements > Dimensional
Last Modified: 02 Feb 2018 13:14
URI: http://eprintspublications.npl.co.uk/id/eprint/5467

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