< back to main site

Publications

Improving plated copper adhesion for metallisation of glass PCBs.

He, B*; Webb, D P*; Petzing, J*; Leach, R K (2011) Improving plated copper adhesion for metallisation of glass PCBs. In: International Conference on Electronic Packaging Technology and High Density packageing 2011 (ICEPT-HDP2011), 8-11 August 2011, Shanghai, China.

Full text not available from this repository.
Item Type: Conference or Workshop Item (UNSPECIFIED)
Subjects: Engineering Measurements
Engineering Measurements > Dimensional
Last Modified: 02 Feb 2018 13:14
URI: http://eprintspublications.npl.co.uk/id/eprint/5220

Actions (login required)

View Item View Item