Sun, W; Leach, R K (2010) Advanced optical techniques for the measurement of the internal geometry of MEMS structures. Proc. SPIE - Int. Soc. Opt. Eng., 7544. pp. 754461-1.

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Abstract

Many modern MEMS devices incorporate multi-layered structures. However, the metrology of such structures is struggling to keep pace with their manufacture. In this paper the measurement of the internal geometry of MEMS devices using optical coherence tomography and infra-red confocal microscopy is discussed. Both measurement techniques provide non-contact, non-invasive measurements of internal geometry. However, both techniques use relatively new technologies for measuring internal geometry and the understanding of their capabilities is limited. The study reported in this paper has mainly focused on the thickness measurement of layers. The performance of both instruments has been investigated by measuring a 50 mm thick plate artefact that had been calibrated using a traceable stylus instrument. The standard uncertainties associated with the measurements of the artefact are 0.391 mm for optical coherence tomography and 1.085 mm for infra-red confocal microscopy. Finally, the capabilities of the two instruments have been highlighted by measuring a pressure sensor containing multi-layered structures. These measurements demonstrated that both instruments have the ability to measure the thickness of layers and to image internal geometrical structures.

Item Type:	Article
Keywords:	MEMS, internal, thickness, measurement, OCT, infra-red confocal microscope
Subjects:	Engineering Measurements Engineering Measurements > Dimensional
Identification number/DOI:	10.1117/12.885607
Last Modified:	02 Feb 2018 13:15
URI:	http://eprintspublications.npl.co.uk/id/eprint/5010

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