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Variation risk analysis: MEMS fabrication tolerance for a micro CMM probe.

Sun, U*; Folkes, C*; Gindy, G*, Leach (2010) Variation risk analysis: MEMS fabrication tolerance for a micro CMM probe. Int. J. Adv. Manufact. Technol., 47 (9-12). pp. 1113-1320.

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Abstract

This paper describes a novel methodology of variation risk analysis for Microsystems using analytical modelling and simulation, a Key Characteristic (KC) method and statistical analysis considering MEMS fabrication tolerances. This methodology is applied to an innovative design for a micro CMM (co-ordinate measuring machine) probe utilizing piezoelectric actuation and sensing currently being developed at the National Physical Laboratory. Analytical modelling is used to investigate the individual effects of dimensional parameters on the sensors¿ open circuit voltage, which is a KC of the micro CMM probe. A computer simulation is performed using the finite-element method and compared with the analytical model.
The KC variation is predicted and the variation contribution of the probe manufacturing processes is presented. This KC is mainly influenced by the thickness of the PZT layer associated with the composite sol gel deposition process. Variation risk analysis results can be used to implement a variation risk mitigation strategy.

Item Type: Article
Subjects: Engineering Measurements
Engineering Measurements > Dimensional
Last Modified: 02 Feb 2018 13:15
URI: http://eprintspublications.npl.co.uk/id/eprint/4584

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